Exclusive

Publication

Byline

Location

US Patent Issued to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES on July 28 for "Three-dimensional static random-access memory and preparation method therefor" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,436, issued on July 28, was assigned to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (Beijing). "Three-dimensional static ran... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor devices having contact plugs" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,437, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices having contact plugs" ... Read More


US Patent Issued to Micron Technology on July 28 for "Support structure for multiple, alternating epitaxial silicon" (Idaho Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,438, issued on July 28, was assigned to Micron Technology Inc. (Boise, Idaho). "Support structure for multiple, alternating epitaxial silic... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor device including an insulating structure on a sidewall of a landing pad" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,439, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including an insulating... Read More


US Patent Issued to Winbond Electronics on July 28 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,440, issued on July 28, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Semiconductor structure and method of manufactu... Read More


US Patent Issued to WINBOND ELECTRONICS on July 28 for "Semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,441, issued on July 28, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure" was invented by Kai Je... Read More


US Patent Issued to BEIJING SUPERSTRIG ACADEMY OF MEMORY TECHNOLOGY on July 28 for "Memory, and method for manufacturing memory" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,442, issued on July 28, was assigned to BEIJING SUPERSTRIG ACADEMY OF MEMORY TECHNOLOGY (Beijing). "Memory, and method for manufacturing me... Read More


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 28 for "Semiconductor structure and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,443, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure and preparation met... Read More


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 28 for "Memory including zigzag bit lines and method for manufacturing same" (Chinese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,444, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Memory including zigzag bit lines and metho... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Integrated circuit with back-side metal line, method of fabricating the same, and layout method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,445, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit with back-si... Read More